led specification page: 1 features single color high bright output low power consumption high reliability and long life descriptions dice material emitting color white device outline 10 mm round type lens type milky diffused directivity 1. all dimensions are millimeters 2. tolerance is +/-0.25mm unless otherwise noted 105MW7D -90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90
led specification absolute maximum ratings ta = 25 value parameter symbol test condition min. max. unit reverse voltage v r i r = 30 a 5 -- v forward current i f ---- ---- 30 ma power dissipation pd ---- ---- 10 8 mw pulse current ipeak duty=0.1ms 1khz ---- 100 ma operating temperature topr ---- -20 +85 storage temperature tstr ---- -25 +100 electrical and optical characteristics ta = 25 value parameter symbol test condition min. typ. max. unit forward voltage v f i f = 20ma v8~v10 reverse current i r v r = 5v ---- ---- 30 a dominate wavelength d i f = 20ma wa~ wd spectral line half-width ? i f = 20ma ---- --- ---- nm luminous intensity i v i f = 20ma t,u viewing angle 2 1/2 i f = 20ma 40 50 deg. page: 2
b i n c o d e i v ( m c d ) b i n c o d e i v ( m c d ) b i n c o d e i v ( m c d ) b i n c o d e i v ( m c d ) a 0 - 5 . 0 h 3 7 . 2 - 5 2 . 0 q 3 9 0 - 5 5 0 x 4 1 8 0 - - 5 8 6 0 b 5 . 0 - 7 . 0 j 5 2 . 0 - 7 2 . 8 r 5 5 0 - 7 7 0 y 5 8 6 0 - 8 2 0 0 c 7 . 0 - 9 . 8 k 7 2 . 8 - 1 0 2 s 7 7 0 - 1 1 0 0 z 1 8 - 1 0 c d d 9 . 8 - 1 3 . 7 l 1 0 2 - 1 4 5 t 1 1 0 0 - 1 5 2 0 z 2 1 0 - 1 2 c d e 1 3 . 7 - 1 9 . 0 m 1 4 5 - 2 0 0 u 1 5 2 0 - 2 1 3 0 z 3 1 2 - 1 4 c d f 1 9 . 0 - 2 6 . 6 n 2 0 0 - 2 8 0 v 2 1 3 0 - 3 0 0 0 z 4 1 4 - 1 6 c d g 2 6 . 6 - 3 7 . 2 p 2 8 0 - 3 9 0 w 3 0 0 0 - 4 1 8 0 z 5 1 6 - 1 8 c d placing of white color bins on cie table b 1 4 5 0 - 4 5 5 y g 1 5 5 5 - 5 5 8 b 2 4 5 5 - 4 6 0 y g 2 5 5 8 - 5 6 1 b 3 4 6 0 - 4 6 5 y g 3 5 6 1 - 5 6 4 b 4 4 6 5 - 4 7 0 y g 4 5 6 4 - 5 6 7 b 5 4 7 0 - 4 7 5 y g 5 5 6 7 - 5 7 0 b 6 4 7 5 - 4 8 0 y g 6 5 7 0 - 5 7 3 g 1 4 9 1 - 4 9 4 y g 7 5 7 3 - 5 7 6 g 2 4 9 4 - 4 9 7 y 1 5 8 2 - 5 8 5 g 3 4 9 7 - 5 0 0 y 2 5 8 5 - 5 8 8 g 4 5 0 0 - 5 0 3 y 3 5 8 8 - 5 9 1 g 5 5 0 3 - 5 0 6 y 4 5 9 1 - 5 9 4 g 6 5 0 6 - 5 0 9 y 5 5 9 4 - 5 9 7 g 7 5 0 9 - 5 1 2 y o 1 5 9 7 - 6 0 0 g 8 5 1 2 - 5 1 5 y o 2 6 0 0 - 6 0 3 g 9 5 1 5 - 5 1 8 y o 3 6 0 3 - 6 0 6 g 1 0 5 1 8 - 5 2 1 y o 4 6 0 6 - 6 0 9 g 1 1 5 2 1 - 5 2 4 o 1 6 0 9 - 6 1 2 g 1 2 5 2 4 - 5 2 7 o 2 6 1 2 - 6 1 5 g 1 3 5 2 7 - 5 3 0 o 3 6 1 5 - 6 1 8 g 1 4 5 3 0 - 5 3 3 r 1 6 1 8 - 6 2 1 g 1 5 5 3 3 - 5 3 6 r 2 6 2 1 - 6 2 4 g 1 6 5 3 6 - 5 3 9 r 3 6 2 4 - 6 2 7 g 1 7 5 3 9 - 5 4 2 r 4 6 2 7 - 6 3 0 g 1 8 5 4 2 - 5 4 5 r 5 6 3 0 - 6 3 3 g 1 9 5 4 5 - 5 4 8 r 6 6 3 3 - 6 3 6 b i n c o d e v f ( v ) b i n c o d e v f ( v ) b i n c o d e v f ( v ) b i n c o d e v f ( v ) v 1 1 . 6 - 1 . 8 v 5 2 . 4 - 2 . 6 v 9 3 . 2 - 3 . 4 v 1 3 4 . 0 - 4 . 2 v 2 1 . 8 - 2 . 0 v 6 2 . 6 - 2 . 8 v 1 0 3 . 4 - 3 . 6 v 1 4 4 . 2 - 4 . 4 v 3 2 . 0 - 2 . 2 v 7 2 . 8 - 3 . 0 v 1 1 3 . 6 - 3 . 8 v 1 5 4 . 4 - 4 . 6 v 4 2 . 2 - 2 . 4 v 8 3 . 0 - 3 . 2 v 1 2 3 . 8 - 4 . 0 v 1 6 4 . 6 - 4 . 8 b r i g h t n e s s b i n y e l l o w y e l l o w o r a n g e p u r e o r a n g e y e l l o w g r e e n b l u e g r e e n f o r w a r d v o l t a g e ( v f ) b i n r e d b l u e for white color bins see page 3b p u r e g r e e n b i n ranking for leds page: 3a
page: 3b chromaticity coordinates ranks (if=20ma ta=25 ) x 0.243 0.215 0.230 0.263 x 0.263 0.246 0.264 0.280 wa1 y 0.200 0.230 0.250 0.220 wa2 y 0.220 0.236 0.267 0.248 x 0.246 0.230 0.248 0.264 x 0.280 0.264 0.283 0.296 wa3 y 0.236 0.250 0.286 0.267 wb1 y 0.248 0.267 0.305 0.276 x 0.264 0.248 0.275 0.283 x 0.296 0.287 0.330 0.330 wb2 y 0.267 0.286 0.321 0.305 wc1 y 0.276 0.295 0.339 0.318 x 0.287 0.283 0.330 0.330 x 0.283 0.275 0.298 0.306 wc2 y 0.295 0.305 0.360 0.339 wc3 y 0.305 0.321 0.350 0.332 x 0.306 0.298 0.321 0.330 x 0.330 0.330 0.361 0.356 wc4 y 0.332 0.350 0.379 0.360 wd1 y 0.318 0.360 0.385 0.351 x 0.330 0.321 0.366 0.361 x 0.356 0.366 0.391 0.380 wd2 y 0.360 0.379 0.419 0.385 wf y 0.351 0.419 0.436 0.381 if=20ma ta=25 c y wf w d2 w d1 w c4 w c3 w c 2 w c 1 w b2 w b1 w a3 w a2 w a1 x color ranking for white leds
led specification typical electrical/optical characteristic curves 50 40 30 4.0 0 0 50 forward current vs forward voltage luminous intensity vs. forward current 40 50 2.0 1.5 40 30 0.5 20 10 3.6 0 10 2.4 2.0 2.8 0 3.2 20 forward current(ma) luminous intensity relative value at if=20ma 1.0 30 2.5 forward current derating curve 2.0 1.5 20 2.5 luminous intensity vs. ambient temperature 100 80 60 0.5 20 0 -20 100 -40 60 80 20 40 0 0 ambient temperature t a () ambient temperature t a () 40 relative luminous intensity forward current(ma) 10 1.0 if-forward current (ma) forward voltage(v) ta=25 700 650 600 550 500 450 1.2 0.8 1.0 0.2 0.4 0.6 400 0 wavelength (nm) relative luminous intensity page: 4
led lamp application y soldering method soldering conditions remark dip soldering bath temperature: 2605 immersion time: with 5 sec y solder no closer than 3mm from the base of the package y using soldering flux,? resin flux? is recommended. soldering iron soldering iron: 30w or smaller t emperature at tip of iron: 260 or lowe r soldering time: within 5 sec. y during soldering, take care not to press the tip of iron against the lead. (to prevent heat from being transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) when soldering the lead of led in a condition that the pack age is fixed with a panel (see fig.1), be careful not to stress the leads with iron tip. 2) when soldering wire to the lead, work with a fig (see fig.2) to avoid stressing the package. page : 5 p a n e l (fig.1) l e a d w r i e s l e a v e a s l i g h t c l e a r a n c e l e a d w r i e s (fig.2)
3) similarly, when a jig is used to solder the led to pc board, take care as much as possible to avoid steering the leads (see fig.3). 4) repositioning after soldering should be avoided as much as possible. if inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the led. 5) lead cutting after soldering should be performed only after the led temperature has returned to normal temperature. y led mounting method 1) when mounting the led by using a case, as shown fig.4, ensure that the mounting holds on the pc board match the pitch of the leads correct ly-tolerance of dimensions of the respective components including the led should be taken into account especially when designing the case, pc board, etc. to prevent pitch misa lignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. alternatively, the shape of the holes should be made oval. (see fig.4) page : 6 p c b o a r d ig.3 f jig fig.4 case pc board led lamp application
2) use leds with stand-off (fig.5) or the tube or spacer made of re sin (fig.6) to position the leds. y formed lead 1) the lead should be bent at a point located at least 2mm away from the package. bending should be performed with base fixed means of a jig or pliers (fig.7) 2) forming lead should be carried our prior to so ldering and never during or after soldering. 3) form the lead to ensure alignment between the leads and the hole on board, so that stress against the led is prevented. (fig.8) page : 7 stand-off fig.5 fig.6 tube 2 m m f i g . 7 led lamp application
y lead strength 1) bend strength do not bend the lead more than twice. (fig.9) 2) tensile strength (@ room temperature) if the force is 1kg or less, there will be no problem. (fig.10) y handling precautions although rigid against vibration, the leds may damaged or scratched if dropped. so take care when handling. y chemical resistance 1) avoid exposure to chemicals as it may at tack the led surface and cause discoloration. 2) when washing is required, refer to the follo wing table for the proper chemical to be sued. (immersion time: within 3 minutes at room temperature.) solvent adaptability freon te chlorothene w isopropyl alcohol thinner w acetone w trichloroethylene w --usable w --do not use. page : 8 fi g .9 ok fig.10 1kg note: influences of ultras onic cleaning of the led resin body differ depending on such factors as the oscillator output, size of the pc board and the way in which the led is mounted. therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical. led lamp application
experiment item: test condition item lamp & ir reference standard operation life ta 25 5 if= 20ma rh =60%rh dynamic:100ma 1ms 1/10 duty static state: if 20ma test time: 168hrs -24hrs +24hrs 500hrs -24hrs +24hrs 1000hrs -24hrs +72hrs mil-std-750 1026 mil-std-883 1005 jis c 7021 b-1 high temperature high humidity storage ta 65 5 rh 90 ? 95%rh test time 240hrs 2hrs mil-std-202 103b jis c 7021 b-1 temperature cycling 105 ? 25 ? -55 ? 25 30min 5min 30min 5min 10cycles mil-std-202 107d mil-std-750 1051 mil-std-883 1010 jis c 7021 a-4 thermal shock 105 5 ? -55 5 10min 10min 10cycles mil-std-202 107d mil-std-750 1051 mil-syd-883 1011 solder resistance t sol 260 5 dwell time 10 lsec mil-std-202 210a mil-std-750-2031 jis c 7021 a-1 solderability t sol 230 5 dwell time 5 lsec mil-std-202 208d mil-std-750 2026 mil-std-883 2003 jis c 7021 a-2 page : 9 led lamp passed tests drive method circuit model a circuit model b (a)recommended circuit. (b)the difference of brightness between led`s could be found due to the vf-if characteristics of led.
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